Summary

Engineers work on optimizing microelectronics such as IGBTs and SMDs to improve device performance, minimize energy consumption, and ensure reliability. This optimization extends the life cycle, enhances functionality, increases energy efficiency, and reduces heat dissipation in applications ranging from power electronics to consumer devices. Ultimately, it drives technological advancements, creating smaller, more powerful, and energy-efficient electronics across various industries.

Simultaneously, engineers face pressure to follow the Global Standards for the Microelectronics Industry (JEDEC) – A global organization that establishes standards for the microelectronics industry that develops guidelines for design, testing, and quality assurance, ensuring compatibility and interoperability among different manufacturers’ products-. Adhering to JEDEC standards promotes consistency, reliability, and ease of integration in electronic systems, fostering efficiency across the microelectronics industry.

Keeping up with market demands and industry standards has its own set of challenges. For example, some of the physical tests of microelectronics require high-pressure and high-temperature environments. Moreover, performing physical testing of microelectronics is costly, time-consuming, and limits flexibility for design modifications. The need for precise instrumentation, potential damage to prototypes during testing, and the difficulty in assessing long-term reliability contribute to the complexities of physical testing in the microelectronics industry.

Join this webinar to find out how you can leverage the power of modeling and simulation techniques to ensure compliance with JEDEC standards, extend the life cycle of microelectronics, reduce physical prototypes, and lower costs. 

Attend this webinar if you

• Are looking for a simulation tool to estimate the life-cycle of microelectronics components
• Want to learn the workflow of creating stress analysis of an IGBT model under the Highly Accelerated Stress Test (HAST) condition in COMSOL Multiphysics. 
• Want to have an understanding of the modeling of the stress analysis of an IGBT model subjected to a four-point bending test (test condition based on the standard BS ISO 23212: 2020.)
• Want to learn how to model the Preconditioning (PRE) of Surface Mount Devices (SMDs) for testing (Test methods based on the standard JESD22-A113I  and standard JESD22-A110.

Agenda

• What is COMSOL Multiphysics?
• Standards for microelectronic devices (JEDEC)
• Stress analysis of an IGBT model
• Preconditioning (PRE) of Surface Mount Devices (SMDs) for testing
• Four-Point Bending Test of an IGBT model
• Summary and Q&A